Common housing for two semi-conductor bodies

US4683489A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Michael Langenwalter · Gauting, DE
• Karl-Heinz Moehrmann · Munich, DE
• Herbert Prussas · Pfaffenhofen an der Ilm, DE
• Lothar Spaeter · Annweiler am Trifels, DE

Key dates

• Filing date: Aug 5, 1985
• Grant date: Jul 28, 1987
• Expiry date: Aug 5, 2005

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3011
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A common housing for two semi-conductor bodies is provided, comprising a front and back section for two spatially separate semi-conductor bodies attached in the housing interior but preferably connected in electrically conductive fashion to one another, whereby the housing surface preferably composed entirely of metal is cooled during operation by a flowable coolant, preferably cooling air. The front, first semi-conductor body is attached in the front section thereof and the back, second semi-conductor body is attached in the back section thereof, the maximum operating temperature of the back semi-conductor body being higher than the maximum operating temperature of the front semi-conductor body, at least at times. The thermal resistance between the front semi-conductor body and a front thermally conductive cooling surface as well as the thermal resistance between the back semi-conductor body and a back thermally conductive cooling surface differing from the front cooling surface, being respectively lower than both the thermal resistance in the housing interior between the two semi-conductor bodies as well as the thermal resistance between the front and the back cooling surface. Du…