Die mounting apparatus
US4683822A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 1985 |
| Grant date | Aug 4, 1987 |
| Priority date | — |
| Expiry date | Sep 17, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/7747
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Apparatus for mounting a flexible printing plate comprises a printing cylinder having a surface upon which the printing plate is mountable, and a connection for applying subatmospheric pressure inside the cylinder. A plurality of valves selectively apply the subatmospheric pressure to the surface from inside the cylinder. These valves have depressable actuating members protrudable above the cylinder surface. Those actuating members contacted by the printing plate when applied to the cylinder surface are depressed thereby to effect application of subatmospheric pressure to beneath the printing plate to draw the plate against the cylinder. Preferably, grooves are provided in the cylinder surface for distribution of the subatmospheric pressure beneath the plate. Advantageously, the printing plate may have a thin, highly flexible and deformable fringe along its trailing edge to seal the surface grooves, at that location. This mounting arrangement facilitates quick changing of printing plates during printing operations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.