Thermoplastic resin composition having improved moldability comprising homogeneous blends of the resin with diamides
US4684684A · kind A · utility
6Cited by
8References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 1985 |
| Grant date | Aug 4, 1987 |
| Priority date | — |
| Expiry date | Mar 7, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A composition comprising an amorphous resin (excluding polyphenylene ether) and a specific diamide compound of the formula ##STR1## wherein R.sup.1, R.sup.2 and R.sup.3 are defined in the specification. The moldability of the amorphous resin is improved without reducing its heat resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.