Method for bonding using laser induced heat and pressure
US4684781A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 1985 |
| Grant date | Aug 4, 1987 |
| Priority date | — |
| Expiry date | Jan 29, 2005 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A coated substrate manufactured by applying a layer of a material to the substrate and generating thermal and pressure waves in the layer by exposing the layer to high intensity, short duration laser radiation, and the process of manufacturing such a coated substrate. The laser radiation is applied in an intensity range that creates an instantaneous surface vaporization of the layer material that in turn drives a pressure wave into the layer. The pressure wave interacts with the layer-substrate interface to create bonding between them of varying strengths and qualities depending on the intensity and duration of the initial laser pulse. A thermal wave is created in some regimes of operation, or results from compressional heating of the layer by the pressure wave, and is of sufficient energy to contribute to the bonding at the interface. The coating and the process for its creation has application in diverse areas where surface properties of a particular color, hardness, corrosion resistance, abrasion resistance, electrical conductivity, among others are desired.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.