Universal test circuit for integrated circuit packages
US4684884A · kind A · utility
81Cited by
1References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 2, 1985 |
| Grant date | Aug 4, 1987 |
| Priority date | — |
| Expiry date | Jul 2, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An integrated circuit which facilitates measurement of various integrated circuit packaging parameters, including atmospheric moisture content, impurity content, water vapor transmission rate of encapsulant, corrosion of metallization, temperature, thermal impedance, and strain sensing. This circuit can be interconnected via both wire bonding and mass bonding, and it functions as a test vehicle for the tape automated bonding process. This circuit includes a plurality of subcircuits arranged in a square array such that the test capabilities of both the complete circuit and each individual subcircuit is identical.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.