Curable epoxy resin composition
US4689390A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Mar 14, 1986 |
| Grant date | Aug 25, 1987 |
| Priority date | — |
| Expiry date | Mar 14, 2006 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/4007
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermosetting epoxy resin composition of one pack type is provided which contains as indispensable constituents (I) an epoxy resin containing more than one adjacent epoxy groups on the average in the molecule and (II) a curing amount or curing-accelerating amount of a compound obtained by reacting (a) a specified amine/epoxy adduct with (b) phenolic resin(s) and/or polyhydric phenol compound(s) in a weight ratio of (a) to (b) of 1/0.1 to 1/0.8. The composition of the present invention has excellent storage stability and it is curable at a relatively low temperature to form a cured product having excellent mechanical strength, adhesiveness and water resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.