Patent · US Expired

Housing-free vertically insertable single-in-line circuit module

US4689719A · kind A · utility

8Cited by

11References

20Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Herbert Prussas · Pfaffenhofen an der Ilm, DE
Peter Stern · New York, US

Key dates

Filing date	Apr 18, 1985
Grant date	Aug 25, 1987
Priority date	—
Expiry date	Apr 18, 2005

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/0058
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A housing-free, vertically insertable single-in-line circuit module has a carrier consisting of synthetic film or ceramic which carries a series of metal terminal pins and one or more electrical components including at least one integrated semiconductor circuit element, and associated conductor runs connecting the circuit element to the terminals, and the carrier has one lateral face thereof which is substantially covered by a metallic cooling sheet for permitting improved cooling of the circuit module by convection.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.