Wafer and method for manufacturing switch wafer
US4690484A · kind A · utility
8Cited by
3References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 26, 1985 |
| Grant date | Sep 1, 1987 |
| Priority date | — |
| Expiry date | Dec 26, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a switch includes the steps of forming integrally a clip for clamping a movable contact out of a flat terminal member configured in hoop material by bending uprightly a projected portion of the terminal member, and then insert-molding the thus bent terminal member at the bottom of a box body made of insulating material to hold the integrally formed clip inside the box body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.