Thermal profile system
US4690569A · kind A · utility
18Cited by
8References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 22, 1986 |
| Grant date | Sep 1, 1987 |
| Priority date | — |
| Expiry date | May 22, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3494
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Apparatus and method for implementing a characterized thermal profile upon a temperature/time dependent process on any material or materials susceptible to such thermal processing in accordance with a closed loop environmental feedback system and a corresponding predetermined characterized thermal profile.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.