Process for the production of void-free prepreg sheets
US4690836A · kind A · utility
11Cited by
14References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 1985 |
| Grant date | Sep 1, 1987 |
| Priority date | — |
| Expiry date | Oct 23, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/022
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is disclosed for the manufacture of void-free prepregs formed by the impregnation of a reinforcing cloth (e.g. glass fiber cloth) with a solution of a thermosetting resin (e.g. epoxy resin). In the method, the reinforcing cloth is first prewetted with a liquid medium containing a solvent for the resin which has a viscosity less than that of the solution of thermosetting resin. The prewetted cloth is impregnated with a solution of the resin and then heated to remove the solvent and cure the resin. The prepregs are used in the manufacture of printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.