Heat-curable organopolysiloxane compositions
US4690967A · kind A · utility
21Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1984 |
| Grant date | Sep 1, 1987 |
| Priority date | — |
| Expiry date | Dec 21, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/70
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Improved heat-curable organopolysiloxane compositions, easily vulcanizable into silicone elastomers, are comprised of (A) a major amount of a diorganopolysiloxane gum, (B) a reinforcing filler therefor, (C) optionally, a diorganopolysiloxane oil, (D) an organic peroxide catalyst, and minor amounts of at least three of the following four additives: (E) an organohydrogenopolysiloxane, (F) an organofluorinated polymer, (G) an organosilonxane irgabcompound bearing at least one acroyloxyalkyl or methacroyloxyalkyl substituent covalently bonded to a silicon atom thereof, and (H) a boron compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.