Diffusion bonding method using a high energy beam
US4691856A · kind A · utility
8Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 1985 |
| Grant date | Sep 8, 1987 |
| Priority date | — |
| Expiry date | Jun 28, 2005 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/004
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed is a diffusion bonding method which can be applied to superalloys and comprises forming in advance an alloy layer containing an additional element or elements having a higher diffusion speed than that of the principal constituent element of a base metal and a lower melting point than that of the base metal on the joint surface of the base metal consisting of a heat-resistant superalloy based on Co, Ni, Fe, Ti or the like, and bringing the joint surfaces into contact so as to diffuse B.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.