Method and apparatus for drawing a thick film circuit
US4692351A · kind A · utility
29Cited by
8References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1985 |
| Grant date | Sep 8, 1987 |
| Priority date | — |
| Expiry date | Dec 16, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for drawing a thick film circuit on a substrate (2) by discharging a paste from a paste discharge hole provided at one end of a drawing nozzle (1), the drawing nozzle (1) being located close to the substrate (2) and relatively moved with respect to the substrate (2). The discharge rate of the paste is controlled in accordance with the relatively moving speed between the drawing nozzle (1) and the substrate (2), thereby preventing variations of film thickness and line width caused by variations in the moving speed and making it possible to form a thick film circuit at a high speed and with high accuracy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.