Unique epoxy resin compositions and composite molded bodies filled therewith
US4692499A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 1986 |
| Grant date | Sep 8, 1987 |
| Priority date | — |
| Expiry date | May 15, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermosetting resin composition of an epoxy resin mixture of 1,2 epoxy resin having at least two epoxide groups per molecule and a polyglycol diepoxide having viscosity of 2,000-5,000 centipoises at 25.degree. C. and in addition small but effective amounts of both a catalytic hardener and an accelerator has special utility in the production of composite molded bodies of electrical insulation having thermoplastic shells because of its unique combination of properties including thermal stability, thermal-cycling crack resistance, high impact strength, toughness, room-temperature curability and bondability to both thermoplastic and metallic surfaces, and because it does not stress crack thermoplastic shells to which it is bonded in curing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.