Method of and system for opto-electronic inspection of a two-dimensional pattern on an object
US4692943A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1984 |
| Grant date | Sep 8, 1987 |
| Priority date | — |
| Expiry date | Dec 27, 2004 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30141
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In a method of opto-electronic inspection of a two-dimensional pattern on an object, especially a printed board, a micro-inspection is carried out by subjecting line-by-line scanned picture elements in pixel-by-pixel fashion to a sequence of picture operations for inspection of dimensions and spacings, and the respective result is compared with the corresponding scanned pixel. At the same time a macro-inspection is carried out by combining the scanned pixels to frames and by respective reduction thereof to a single characteristic picture information, whereupon a comparison is again performed, but this time with the corresponding picture information of a reference picture. In this way it is possible to perform a quick and fully automatic real-time inspection of two-dimensional patterns, for instance printed boards, both for minute and hardly visible defects and for macro-defects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.