Process for producing plasma polymerized film
US4693799A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Mar 19, 1986 |
| Grant date | Sep 15, 1987 |
| Priority date | — |
| Expiry date | Mar 19, 2006 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D1/62
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for producing a plasma polymerized film, which comprises forming a plasma polymerized film on the surface of a substrate placed in a reaction zone by subjecting an organic compound containing gas to plasma polymerization utilizing low temperature plasma formed by pulse discharging, in which the time for non-discharge condition is at least 1 msec. and the voltage rise time for gas breakdown is not longer than 100 msec. The plasma polymerized film obtained has a small coefficient of friction, high lubricity, durability and heat resistance and is useful as a solid lubricating film, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.