Method of forming conductor path
US4694138A · kind A · utility
33Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1984 |
| Grant date | Sep 15, 1987 |
| Priority date | — |
| Expiry date | Nov 30, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A conductor path is formed by providing an insulating substrate having a surface region which is formed of an insulating composition. The insulating composition contains an organic polymeric material and at least one metal source. The metal source is a metallic powder and/or an organic compound chemically combining a metal or metals. The surface region of the substrate is selectively heated along a predetermined pattern, thereby decomposing and evaporating the organic polymeric material at the heated portion and welding the metal in the heated portion so as to form a conductor path formed of the metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.