Barrier layer and orifice plate for thermal ink jet printhead assembly
US4694308A · kind A · utility
50Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 1986 |
| Grant date | Sep 15, 1987 |
| Priority date | — |
| Expiry date | Dec 4, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
This application discloses a thermal ink jet printhead and method of manufacture featuring an improved all-metal orifice plate and barrier layer assembly. This assembly includes constricted ink flow ports to reduce cavitation damage and smooth contoured convergent ink ejection orifices to prevent "gulping" of air during an ink ejection process. Both of these features extend the maximum operating frequency, fmax, of the printhead. The nickle barrier layer and the underlying thin film resistor substrate are gold plated and then soldered together to form a good strong solder bond at the substrate-barrier layer interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.