Thick film conductor composition
US4695403A · kind A · utility
16Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 1986 |
| Grant date | Sep 22, 1987 |
| Priority date | — |
| Expiry date | Jun 17, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/092
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A thick film conductor composition for a ceramic wiring substrate comprises an inorganic ingredient mainly composed of a copper oxide powder added with a metal capable of forming a homogeneous solid solution with copper, and an organic vehicle. The inorganic ingredient may be further added with a manganese oxide or a heat resistant insulating material such as ceramics and/or glass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.