Thick film resistor composition
US4695504A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1986 |
| Grant date | Sep 22, 1987 |
| Priority date | — |
| Expiry date | Jun 18, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thick film resistor composition, comprising a silicide powder composed of a molybdenum disilicide, a tantalum disilicide and a magnesium silicide, and an alkaline earth borosilicate glass powder dispersed in a vehicle containing a heat-depolymerizing organic polymer. The thick film resistor composition, employing this heat-depolymerizing organic polymer, can be fired in a nonoxidizing atmosphere and coexist with base metal materials such as copper electrodes. Owing to the Nb.sub.2 O.sub.5 and Ta.sub.2 O.sub.5 contained in the alkaline earth borosilicate glass powder, the thick film resistor composition is free from sheet resistivity fluctuation, according to resistor length, which would result from diffusion of the electrode material into the resistor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.