Metal cored board and method for manufacturing same
US4695515A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 1985 |
| Grant date | Sep 22, 1987 |
| Priority date | — |
| Expiry date | Jul 26, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31699
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
It is disclosed that a metal cored board which comprises a base metal core, an easily solderable metal plating layer formed on one surface of the base metal core, an electrically insulating layer formed on the another surface of the base metal core, and an electrically conductive metal layer formed on the electrically insulating layer, a method for manufacturing a metal cored board, which comprises a step to plate both surface of a base metal core with an easily solderable metal, a step to form an electrically insulating layer on one surface of the easily solderable metal plating layer, and a step to form an electrically conductive metal layer on the electrically insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.