Waffleline-configured microwave transmission link
US4695810A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 1984 |
| Grant date | Sep 22, 1987 |
| Priority date | — |
| Expiry date | Oct 22, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P1/00
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A miniaturized transmission link architecture for intercoupling high frequency miniaturized integrated circuit components comprises a thin conductive plate in one surface of which a matrix or grid work of rectilinear grooves or channels are formed, creating "waffle-iron"-like pattern in one surface of the conductive plate. The spacing between channels corresponds to the width of a channel which, in turn, may be sized to substantially match the outer diameter of insulation jacketed wire that is placed in the channels. The depth of a channel or groove is slightly larger than the outer diameter of the wire to accommodate wire crossovers at intersections of the channels. The top surface of the "waffle-plate" is provided with a conductive foil to complete the shielding for the wires. Because the waffle structure has the same periodicity along either of the orthogonal directions of the channels, the characteristic impedance of the transmission link is readily defined by the size of the lands or mesas that are bounded by the channels and the widths of the channels themselves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.