Thin film vertical resistor devices for a thermal ink jet printhead and methods of manufacture
US4695853A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 1986 |
| Grant date | Sep 22, 1987 |
| Priority date | — |
| Expiry date | Dec 12, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The specification describes thermal ink jet (TIJ) processes and device structures produced thereby wherein either heater resistors or heater resistor-diode combinations are constructed vertically upward from a common supporting substrate. A lower or first metal level conductor pattern provides one part of an X-Y matrix multiplex connection to the resistor/diode components, and a second, upper metal level conductor pattern forms the second part of the X-Y matrix multiplex connection. In this manner, the multiplex drive circuitry for the TIJ printhead resistors/diodes may be fabricated (integrated) directly on the thin film resistor (TFR) printhead substrate. Additionally, the second level metal conductors which overlie the resistive heater and diode elements also serve as a barrier shield to ink corrosion and cavitation wear.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.