Patent · US Expired

Single chip thermal tester

US4696578A · kind A · utility

46Cited by
8References
24Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 19, 1986
Grant dateSep 29, 1987
Priority date
Expiry dateJun 19, 2006

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A thermal tester for measuring the efficiency of a heat transfer device for cooling semiconductor chips is disclosed having a positioning means operable to position the heat transfer device in thermal contact with the chip. The positioning means is adjustable in at least 5 degrees of freedom. Temperature sensors are provided to sense the temperature of the chip, the chip support substrate and the positioning means adjacent the heat transfer device. Means is provided to dispose the chip and heat transfer device in a vacuum. Control means is also provided to adjust the temperature of the chip unitl it is the same as the substrate to thereby assure heat transfer occurs only from the chip to the positioning means by way of the heat transfer device. When this thermal balance is achieved the thermal resistance of the heat transfer device can be calculated.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.