Semiconductive resin composition
US4696765A · kind A · utility
9Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 1984 |
| Grant date | Sep 29, 1987 |
| Priority date | — |
| Expiry date | Oct 18, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/04
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A semiconductive resin composition used in power cables having excellent properties is disclosed, which comprises 100 parts by weight of a base resin of at least one member selected from the group consisting of a low-density polyethylene, an ethylene/vinyl acetate copolymer having a vinyl acetate content of 25% by weight or less and an ethylene/(meth)acrylate copolymer having a (meth)acrylate content of 20% by weight or less, and 6 to 25 parts by weight of electroconductive carbon black having a DBP-absorption number of 220 to 340 ml/100 g and an impurity metal residue of 0.2% by weight or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.