Method for applying a uniform coating to integrated circuit wafers by means of chemical deposition
US4696833A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1985 |
| Grant date | Sep 29, 1987 |
| Priority date | — |
| Expiry date | Oct 30, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/935
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and an apparatus are disclosed which are suitable for applying uniform coatings to integrated circuit (IC) wafers by means of chemical vapor deposition in a process suitable for use in mass production of IC wafers. The process introduces a first group of reactant gases into the vicinity of the wafers through at least one inlet. The number of inlets and the positions of inlets are selected to reduce the total variation in thickness produced on a batch of wafers to within preselected values of variations. The choices of pressure and temperature as well as the choice of gases in the first group are selected to optimize uniformity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.