Heat pipe
US4697205A · kind A · utility
41Cited by
6References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 13, 1986 |
| Grant date | Sep 29, 1987 |
| Priority date | — |
| Expiry date | Mar 13, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor circuit construction in which the semiconductor junction is constructed as an integral part of a heat pipe to eliminate the casing which interferes with heat flow. The semiconductor chip material directly forms one wall of the casing of a heat pipe which is constructed as a hollow wafer-like configuration. A special material formed from a mixture of glass and the semiconductor material and which is directly adjacent to the backside of the semiconductor chip is used as the heat pipe wick.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.