Resin-molded semiconductor device
US4698660A · kind A · utility
13Cited by
5References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 1986 |
| Grant date | Oct 6, 1987 |
| Priority date | — |
| Expiry date | Feb 12, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin-molded semiconductor package device includes a plurality of grooves which are spaced a predetermined distance from each other in the edge portions defined by the main surface and the side surfaces of the main body of a resin-molded package, which grooves correspond to a plurality of external leads. The external leads are folded, the tips of the external leads are positioned in the grooves, and the middle portions of the external leads are located above the main surface of the package so that a predetermined standoff distance is maintained between the middle portions of the external leads and the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.