Modular packaging system
US4699270A · kind A · utility
30Cited by
28References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 9, 1985 |
| Grant date | Oct 13, 1987 |
| Priority date | — |
| Expiry date | Sep 9, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/18
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic component packaging system provides individual structural elements of modules that provide both the strength and the internal structure to mount electrical components such as circuit boards without the use of subracks. The resulting structure provides up to 15 percent more usable space for circuit boards. The modules are constructed as to be easily fixed to one another to form a multiple element modular packaging system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.