Laser soldering apparatus and method
US4700044A · kind A · utility
87Cited by
16References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 1986 |
| Grant date | Oct 13, 1987 |
| Priority date | — |
| Expiry date | Jul 31, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Fine wires are soldered without flux to solder pads on a flexible circuit of a workpiece by a laser. The laser beam is aligned and moved over the solder pad to describe a rectangle by movement of mirrors on a programmed, motor driven X-Y-Z linear table. Wires are deeply sunk into the solder pads by the weight of a cone brought against the wire carried by the X-Y-Z table. Vaporized insulation is restrained within the cone to maintain a clean microelectronic workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.