Method for manufacturing semiconductor power modules with an insulated contruction

US4700879A · kind A · utility

Assignee

• Brown, Boveri & Cie AG · DE

Inventors

• Werner Weidenauer · Lampertheim, DE
• Bernd Leukel · Weinheim, DE
• Klaus Bunk · Ahlhorn, DE

Key dates

• Filing date: Jun 3, 1985
• Grant date: Oct 20, 1987
• Expiry date: Jun 3, 2005

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D62/117
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for manufacturing insulated semiconductor power modules includes: presoldering a plurality of semiconductor sandwiches and a carrier unit including a metal base plate, ceramic insulating discs and connecting tabs with a high-melting solder in a first step; joining the semiconductor sandwiches and the carrier unit together with a low-melting solder in a second step; performing the first and second soldering steps without flux in a gas from the group consisting of hydrogen and forming gas; and preventing a mixture of the high-melting solder and the low-melting solder during the second step.