Multiple foil transient liquid phase bonding
US4700881A · kind A · utility
19Cited by
2References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 20, 1984 |
| Grant date | Oct 20, 1987 |
| Priority date | — |
| Expiry date | Dec 20, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12944
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The bonding of materials by the transient liquid phase process is improved through the use of multiple boronized interlayer foils. By providing the interlayer in the form of multiple foils a reservoir of liquid material is formed during the bonding process which eliminates the previously encountered porosity. The use of multiple foils is especially appropriate when bonding fine grained materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.