Polyamide ester photoresist formulations of enhanced sensitivity

US4701300A · kind A · utility

Assignee

• Merck Patent GmbH · DE

Inventors

• Hans-Joachim Merrem · Walldorf, DE
• Rudolf Klug · Aschaffenburg, DE
• Thomas Herold · Boxberg, DE

Key dates

• Filing date: Jan 15, 1986
• Grant date: Oct 20, 1987
• Expiry date: Jan 15, 2006

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S430/128
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Photoresist formulations for forming relief structures from highly heat-resistant polyimide polymers, containing in an organic solvent in essence at least PA0 (a) one polyamide ester prepolymer carrying photopolymerizable radicals PA0 (b) a radiation-reactive copolymerizable unsaturated compound PA0 (c) a photosensitizer PA0 (d) a photoinitiator PA0 (e) a leuco dye, exhibit enhanced photosensitivity if they contain as the photoinitiator a compound of the type of the N-azidosulphonylarylmaleimides and as leuco dye a compound of the type of the triarylmethanes.