Bonding process using curable epoxide resin adhesive
US4701378A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 1986 |
| Grant date | Oct 20, 1987 |
| Priority date | — |
| Expiry date | Apr 2, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31522
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Adhesion between surfaces of metal, reinforced plastics, glass, friction material or ceramics is effected using an adhesive comprising PA0 (a) an epoxide resin PA0 (b) a nitrogen-containing latent curing agent for this resin, such as dicyandiamide, isophthalic acid dihydrazide or adipic acid dihydrazide, and PA0 (c) as accelerator for the cure, and dispersed as a powder in (a) and (b), a solid solution of a nitrogen base having a boiling point above 130.degree. C. and a phenol-aldehyde resin. Typical nitrogen bases used in (c) include benzyldimethylamine, benzimidazole and 2-methylimidazole. Typical phenolic resins are those prepared from phenol and formaldehyde.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.