Reticle assembly, system, and method for using the same
US4702592A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1986 |
| Grant date | Oct 27, 1987 |
| Priority date | — |
| Expiry date | Jun 30, 2006 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70066
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A reticle assembly, exposure system, and method for exposing each of a plurality of levels of a single die or device dies of a semiconductor wafer to a pattern of radiation on a site-by-site exposure basis are disclosed. Radiation patterning means between a source of radiation and the semiconductor wafer pattern the radiation onto the semiconductor wafer and a stepping means incrementally moves the semiconductor wafer relative to the patterning means for exposing the device dies, one at a time, in succession. The patterning means includes a reticle assembly having a plurality of reticles arranged in a coplanar array with each reticle having a respective different die exposure pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.