Infrared focal plane module
US4703170A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 3, 1986 |
| Grant date | Oct 27, 1987 |
| Priority date | — |
| Expiry date | Nov 3, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An infrared focal plane module as disclosed for interfacing a plurality of detector elements to external electronics. The module comprises a plurality of integrated circuits disposed in substantially overlapping registry to form a module body, each of the integrated circuits is formed to include a layer of semi-conductive material such as silicon disposed upon a major surface of an insulating substrate, e.g. sapphire, to form electronic circuits. Each of the integrated circuits further includes conductive areas formed along first and second edge portions of the substrate to communicate electrical signals to and from the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.