Full chip integrated circuit tester
US4703260A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 1985 |
| Grant date | Oct 27, 1987 |
| Priority date | — |
| Expiry date | Sep 23, 2005 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2656
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Contactless probing of an integrating circuit is carried out by flooding the surface of the integrated circuit with pulsed ultraviolet laser light, causing photoelectron emission as a function of the potentials at micropoints on the integrated circuit, converting this two-dimensional electron pattern into a corresponding relatively long duration pattern of luminescence by a luminescent target, and reviewing the result by video/computer scanning. Separate embodiments allow testing either in vacuum or in air, with or without insulating passivation layers present on the chip. The result is a contactless oscilloscope which monitors instantaneous voltage (logic states and AC switching waveforms) for a full two-dimensional array of micropoints simultaneously. A chip with test points and appropriate windows for laser activation and luminescent targeting can be specially designed for optimal testing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.