System for interconnecting orthogonally disposed printed circuit boards and switching networks employing same
US4703394A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 1986 |
| Grant date | Oct 27, 1987 |
| Priority date | — |
| Expiry date | Oct 24, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/724
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A system for interconnecting orthogonally disposed printed circuit boards in first and second stacks comprises first contact members on facing edges of the boards of the two stacks used to interconnect the boards. A mother board is disposed perpendicular to and between the two stacks of boards. Second contact members are disposed on the same facing edges of the boards as the first contact members. They define with the first contact members a series of first multiway plug-in connectors along the respective edge of each board in the first stack and a series of second multiway plug-in connectors along the respective edge of each board in the second stack. The mother board comprises a distribution network in the form of an array of conductive tracks assigned to distributing signals to the boards. The mother board also carries connecting contact members and distribution contact members connected to the distribution network. They are disposed transversely to the mother board and define on one side of it a set of third multiway plug-in connectors adapted to have the first connectors plugged into them. On the other side of the mother board they define a set of fourth multiway plug-in conne…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.