Method for producing connecting elements for electrically joining microelectronic components

US4703559A · kind A · utility

Assignee

• Kernforschungszentrum Karlsruhe GmbH · DE

Inventors

• Wolfgang Ehrfeld · Karlsruhe, DE
• Peter Hagmann · Erlenbach a.Main, DE
• Dietrich Munchmeyer · Blankenloch, DE
• Erwin Becker · Karlsruhe, DE

Key dates

• Filing date: Nov 1, 1985
• Grant date: Nov 3, 1987
• Expiry date: Nov 1, 2005

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49169
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

Method for producing a plurality of deformable connecting elements for electrically joining microelectronic components. The method includes irradiating with high energy radiation portions of a plate-like member composed of material having a material characteristic which is changed by such high energy radiation, each portion having dimensions corresponding to those of a connecting element; utilizing the changed material characteristic of the material of the irradiated portions to remove such material from the irradiated portions to produce a plate-like mold containing a plurality of mold structures each defining a shape corresponding to a connecting element at a given location of said member, each such mold structure having lateral dimensions and a height dimension which is a multiple of the smallest lateral dimension; filling the mold structures with metal by electroplating the metal into such mold structures to produce metallic connecting elements; fixing the connecting elements to a microelectronic component; and removing the plate-like mold.