Integrated circuit placement device vacuum head
US4703965A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1986 |
| Grant date | Nov 3, 1987 |
| Priority date | — |
| Expiry date | Feb 25, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A vacuum head (10) for pick-up and placement of integrated circuit devices (16, 16'). The apparatus includes an outer housing (18) enclosing therewithin an inner tip assembly (34). The inner tip assembly (34) is disposed for reciprocation through and past an orifice (24) formed in a fitting (26) closing one end of the casing (20) of the outer housing (18). The inner tip assembly (34) has formed therein a shoulder (76) which, when the assembly (34) is moved to an extended position, can engage a seat (78) formed in an inner surface of the fitting (26). An O-ring (80) can be interposed between the shoulder (76) and the seat (78) to preclude vacuum generated in vacuum chamber (30) from being directed other than through an orifice (68) formed in the inner tip assembly (34). An air cylinder (48) is provided to actuate the inner tip assembly (34) for movement between retracted and extended positions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.