Method of forming a lead frame
US4704187A · kind A · utility
13Cited by
1References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 17, 1986 |
| Grant date | Nov 3, 1987 |
| Priority date | — |
| Expiry date | Jun 17, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a lead frame for a semiconductor device, inner leads are formed by etching and outer leads are formed by pressing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.