Multilayer circuit board
US4706165A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Oct 15, 1986 |
| Grant date | Nov 10, 1987 |
| Priority date | — |
| Expiry date | Oct 15, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0286
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a multilayer circuit board wherein a plurality of electronic parts are provided on a first principal plane, a plurality of brazing pads for pins are respectively arranged on a second principal plane and a plurality of wiring layers having wiring nets for connecting said electrical parts are formed between these principal planes. The EC pads for I/O leads for connecting discrete wires is provided to said first principal plane. EC pads are provided on said second principal plane and are connected to the brazing pads for pins in such a manner as to be electrically separable as required. The EC pads for I/O leads and the brazing pads for pins are connected through the interior of the multilayer circuit board and the EC pads are connected to the wiring net through the interior of the multilayer circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.