Surface mount package for encapsulated tape automated bonding integrated circuit modules
US4706811A · kind A · utility
19Cited by
8References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 1986 |
| Grant date | Nov 17, 1987 |
| Priority date | — |
| Expiry date | Mar 3, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3426
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A surface mount package formed by nesting an encapsulated tape automated bonding integrated circuit module in between two plastic rings snapped together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.