Radiation-curable organopolysiloxane compositions
US4707503A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 1985 |
| Grant date | Nov 17, 1987 |
| Priority date | — |
| Expiry date | Nov 21, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The radiation-curable organopolysiloxane composition of the invention is quite free from the problem of the migration of silicone toward the surface of a body in contact with the surface of the cured film of the composition even by curing with an extremely small dose of radiation, e.g. ultraviolet light and electron beams, for curing. The mechanism for curing is in principle the radiation-induced addition reaction between the aliphatically unsaturated bonds in a first organopolysiloxane and the mercapto groups in a second organopolysiloxane but the aliphatically unsaturated bond in the first organopolysiloxane is bonded preferably remotely from the silicon atom with an electron-attractive atom or group intervening therebetween such as the divalent groups of the formula --O--CH.sub.2).sub.2 S-- and --CH.sub.2 --O--CH.sub.2 --S--.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.