Substrate for printed circuit
US4707565A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 17, 1986 |
| Grant date | Nov 17, 1987 |
| Priority date | — |
| Expiry date | Mar 17, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/3431
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a substrate of a printed circuit, a metal foil is mounted onto at least one of the outermost surfaces of a laminate made of a plurality of glass fiber woven fabrics impregnated with synthetic resin, and heated and pressed. Warps and wefts of the glass fiber fabrics filamentated their filaments. The synthetic resin enters gaps among the opening filaments so that the vertically laminated glass fiber fabrics including the opening fibers are integrally jointed with each other. Warps and wefts of the glass fiber fabrics may have their surfaces made fuzzy so that the synthetic resin enters fuzzy filaments. Furthermore, the thus produced substrate may be used as a multilayer printed circuit substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.