Method and apparatus for high speed profile grinding of rotation symmetrical workpieces
US4709508A · kind A · utility
20Cited by
4References
19Claims
0Family size
Inventor
Key dates
| Filing date | Sep 8, 1986 |
| Grant date | Dec 1, 1987 |
| Priority date | — |
| Expiry date | Sep 8, 2006 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B5/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a method and an apparatus for high speed profile grinding of rotatably clamped rotation symmetrical workpieces, a grinding disk of an essentially flat surface line is being guided against the surface of the workpiece so that during the grinding process, the grinding disk touches the circumference of the workpiece in the region of the finished diameter only at a point which lies perpendicular to the longitudinal axis of the workpiece, whereby the surface line of the grinding disk forms a clearance angle with the circumferential line of the ground surface of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.