Cooling arrangement for heat generating electrical components

US4709752A · kind A · utility

Assignee

• U.S. Philips Corporation · US

Inventors

• Johann Schroder · Aachen, DE
• Klaus Gawron · Aachen, DE
• Leo Bertram · Stolberg, DE
• Hugo Schemmann · Valkenburg, NL

Key dates

• Filing date: Jun 27, 1986
• Grant date: Dec 1, 1987
• Expiry date: Jun 27, 2006

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S165/902
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A protection against overheating not only of the heat transmitting component (2), but also of the components (3) surrounding said component is achieved. A latent heat store (1) is provided between the heat transmitting component (2) or a part thereof and a component (3) to be protected from overheating or a part thereof. The latent heat store (1) comprises a latent heat storing agent, whose melting-point T is between the operating temperature of the heat transmitting component (2) and the maximum permissible temperature of the component (3) to be protected. The quantity is proportioned so that the storage capacity of the latent heat store (1) is sufficient for the amount of heat maximally to be transmitted by the heat transmitting component (2). Between the heat transmitting component (2) and the latent heat source (1) and between the latent heat store (1) and the component (3) to be protected a thermal insulation (4,5) is provided. The melting-point T of the latent heat storing agent and the thicknesses d of the insulations (4,5) are proportioned so that the temperature gradient .DELTA.T/d from the heat transmitting component (2) which is at operating temperature to the latent hea…