Semiconductor power module

US4710795A · kind A · utility

Assignee

• Brown, Boveri & Cie AG · DE

Inventors

• Georg Nippert · Worms, DE
• Berthold Hahn · Hemau, DE
• Jens Gobrecht · Wustrow, DE

Key dates

• Filing date: Feb 25, 1985
• Grant date: Dec 1, 1987
• Expiry date: Feb 25, 2005

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15787
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor power module includes at least two mutually parallel ceramic substrates each having two sides, metallizations disposed on at least one side of each of the substrates, at least one controlled semiconductor power component disposed between each two respective substrates and contacted by the metallizations above and below the component, the substrate above the component having at least one hole formed therein above the component for accommodting control connections to the component.