Method for encapsulating semiconductor components mounted on a carrier tape
US4711688A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 6, 1985 |
| Grant date | Dec 8, 1987 |
| Priority date | — |
| Expiry date | Mar 6, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1911
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In the present publication a method is described for encapsulating of components (3), in particular of semiconductor components, mounted on a carrier tape (6) by means of a polymer in order to prevent access of moisture into the component (3). According to the invention a polymer film (24, 25) is pressed onto the support area (2) of each component (3) from both sides of the carrier tape (6), and the carrier tape (6) treated in this way is subjected to warm-air blasting (14). Thereupon, an encapsulating tape (9) that has been moistened with polymer (13) and subjected to a warm-air treatment (15) is connected to one side of the carrier tape (6), and the combination tape (6, 9) in this way obtained is heated in a pre-heating oven (16). Hereupon, encapsulating polymer (26) is spread by means of a dispensing and spreading device (17, 18), onto the face of the component (3) and then onto its ILB area (19), and the combination tape (6, 9) in this way treated is heated in an oven zone (20) in order to harden the polymer. Finally, the encapsulating tape (9) is detached from the carrier tape (6) now containing the encapsulated components (3).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.