Thermistor element and method of manufacturing the same
US4712085A · kind A · utility
12Cited by
6References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1985 |
| Grant date | Dec 8, 1987 |
| Priority date | — |
| Expiry date | Oct 29, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49085
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thermistor element for temperature measurement has a thermistor chip in wafer form and thin film electrodes formed on respective principal surfaces of the thermistor chip. The thin film electrodes are formed by evaporation. Lead wires are adhered to the thin film electrodes with heat-resisting conductive material. The assembled members are sealed with glass. The electrodes may be made of two-layer films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.